18 Mbit synchronous SRAM — 512K x 36 at 133 MHz
The CY7C1381KV33-133AXC: The 36-bit-wide word means a single read fetches a full 32-bit data word plus 4 parity/ECC bits in one cycle — useful in cache tag or network buffer applications where the extra bits carry metadata or error correction without a second bus transaction. The parallel memory interface and SDR (single data rate) architecture mean the address is latched on the rising clock edge and data is valid on the next rising edge — no DDR timing complexity, but the bus width compensates with throughput: at 133 MHz, the peak bandwidth is 133 MT/s × 36 bits = 4.8 Gbit/s (598 MB/s).
Package and board-fit — 100-TQFP (14x20)
Housed in a 100-lead TQFP with a 14x20 mm body (Supplier Device Package 100-TQFP), the 0.5 mm pitch demands a controlled-impedance PCB stack-up for the 133 MHz clock and 36-bit data bus. Supplied in tray format — typical for production-level quantities where pick-and-place lines feed from JEDEC trays rather than tape-and-reel. For rework, a hot-air profile with a top-side preheat around 150°C and a peak of 245°C (lead-free) is standard; the moisture sensitivity level (MSL) should be confirmed from the latest Infineon PCN to determine bake requirements before reflow.
Active lifecycle — no obsolescence risk
Listed as Active (current) by Infineon — no end-of-life notice or last-time-buy window. This part is in standard production and can be sourced through authorized distribution channels.
Supply voltage and temperature grade
This limits deployment to indoor, controlled-environment equipment — networking switches, base stations, storage arrays — not automotive or industrial extended-temp applications.