Clocked at 200 MHz with a 3 ns access time, it is built for high-throughput data-path applications such as network packet buffers, telecom line cards, and FPGA co-processing memory where back-to-back read-write throughput matters more than density.
Infineon lists the CY7C1370D-200BZC as obsolete.
The 200 MHz clock rate and 3 ns access time together define the window for setup-and-hold closure on the data bus. At this speed, trace-length matching on the 36-bit data path becomes critical — expect to budget for controlled-impedance routing and on-die termination if your FPGA or ASIC interface runs at the full clock rate. The NoBL feature removes the one-cycle turnaround penalty that standard synchronous SRAMs impose, so a back-to-back read-write sequence at 200 MHz achieves full bus utilisation without dead cycles. That matters in designs where every clock edge carries a valid transaction.
165-ball FBGA — layout and rework considerations
The 165-ball FBGA package measures 13 x 15 mm with a 1.0 mm ball pitch typical of this density class. It requires a multilayer PCB with via-in-pad or microvia fanout for the centre balls. Rework needs a preheat profile that keeps the package body below 220°C peak to avoid internal die-attach stress; a bottom-side preheater at 150°C and a top-side hot-air nozzle matched to the 13 x 15 mm outline is the standard approach.