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Infineon Technologies CY7C1363D-133AXI — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon CY7C1363D-133AXI 9Mbit SRAM, 133MHz, 100-LQFP

MPNCY7C1363D-133AXI
Obsolete

Infineon Technologies CY7C1363D-133AXI synchronous SDR SRAM, 9Mbit, 512K x 18, 133 MHz clock, 6.5 ns access, 3.135-3.6 V, parallel interface, 100-LQFP, -40 to 85 °C, Tray.

$11.4200Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

CY7C1363D-133AXI specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Supply voltage3.135V ~ 3.6V
Clock frequency133 MHz
Memory interfaceParallel
Operating temperature-40°C ~ 85°C (TA)
PackageTray
TechnologySRAM - Synchronous, SDR
Access time6.5 ns
Memory size9Mbit
Memory formatSRAM
Case100-LQFP
Memory organization512K x 18

Product details

The CY7C1363D-133AXI is marked obsolete by Infineon Technologies.

The CY7C1363D-133AXI is a 9 Mbit synchronous SDR SRAM organized as 512K words by 18 bits. The 133 MHz clock frequency yields a 6.5 ns access time, placing it in the mid-speed tier for synchronous SRAMs of this density. The industrial temperature range (-40 °C to 85 °C) suits it for factory-floor controllers, telecom line cards, and other thermally demanding environments.

Housed in a 100-lead LQFP (supplier device package 100-TQFP, 14x20 mm body), the part is surface-mount and supplied in tray packaging. The 0.5 mm pitch requires a controlled impedance layout for the parallel bus; the wide body provides adequate breakout room on a four-layer board. The parallel interface simplifies integration with legacy FPGA or ASIC designs that lack a high-speed serial memory controller.

Frequently asked questions

What is the memory organization and clock speed of CY7C1363D-133AXI?

The device is organized as 512K words by 18 bits (9 Mbit total) and operates at a 133 MHz clock frequency with a 6.5 ns access time.

What package does CY7C1363D-133AXI use?

It is supplied in a 100-lead LQFP (100-TQFP, 14x20 mm body) in tray packaging, intended for surface-mount assembly.