The CY7C1360C-166BZC is in a Last Buy lifecycle stage, meaning Cypress (now Infineon) has scheduled the final production window. This is not an NRND or sudden EOL — there is still a defined last-time-buy period, but once that window closes, the part will no longer be manufactured.
166 MHz clock, 3.5 ns access — timing budget for high-throughput buffers
The 256K x 36 organization matches a 36-bit data bus common in DSP or FPGA memory interfaces — the extra 4 bits over a 32-bit word can carry parity or ECC without widening the bus. At 166 MHz, PCB layout must control trace lengths and impedance; the 165-FBGA package (13x15 mm, 1.0 mm ball pitch) demands careful fanout and decoupling placement within 5 mm of the supply balls.
If your application sees temperature excursions below freezing, a wider-temperature sibling in the same Cypress synchronous SRAM family would be the correct choice.
Package and rework notes for the 165-FBGA
Reballing requires a stencil matched to the ball diameter and a preheat profile that keeps the package body below 220°C to avoid internal die stress.
