NoBL synchronous SRAM for high-throughput parallel buses
The CY7C1356C-166AXIT: The part is intended for high-bandwidth parallel-memory interfaces in networking equipment, base stations, and industrial controllers where deterministic latency and back-to-back throughput matter.
Industrial temperature range — outdoor and factory-floor fit
The 100-TQFP package (14x20 mm) is a standard fine-pitch surface-mount footprint, reflow-compatible with lead-free profiles. The tape-and-reel delivery (TR suffix) feeds directly into pick-and-place for volume assembly.
Active lifecycle — no LTB concern for production builds
Infineon lists this part as Active. The base product number CY7C1356 covers a range of speed and package variants, so if a future board spin needs a different speed grade or a wider temperature option, the footprint and interface remain the same.