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Infineon Technologies CY7C1354C-200AXC — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon CY7C1354C-200AXC 9Mbit SRAM, 200 MHz, 100-TQFP

MPNCY7C1354C-200AXC
Obsolete

Infineon Technologies NoBL™ SRAM, CY7C1354C-200AXC, 9Mbit synchronous SDR, 256K x 36 organization, 200 MHz clock, 3.2 ns access, 100-TQFP (14x20), tray.

$12.8800Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

CY7C1354C-200AXC specifications
ParameterValue
SeriesNoBL™
Memory typeVolatile
MountingSurface Mount
Supply voltage3.135V ~ 3.6V
Clock frequency200 MHz
Memory interfaceParallel
Operating temperature0°C~70°C(TA)
PackageTray
TechnologySRAM - Synchronous, SDR
Access time3.2 ns
Memory size9Mbit
Memory formatSRAM
Case100-LQFP
Memory organization256K x 36

Product details

The CY7C1354C-200AXC is marked obsolete by Infineon.

NoBL architecture and synchronous interface

This is a 9 Mbit synchronous SRAM organized as 256K x 36, part of the NoBL™ (No Bus Latency) series. The NoBL pipeline eliminates the dead bus cycle between read and write operations — the controller can issue a write on the clock cycle immediately following a read without inserting an idle cycle, which matters for back-to-back throughput in cache or buffer applications. The parallel memory interface runs at a 200 MHz clock frequency, with a 3.2 ns access time from the clock edge. At this speed, the timing closure on the board depends on the trace length matching and the output load capacitance — the 3.2 ns spec is the datasheet maximum at the rated supply and temperature, not a typical number.

Supply, temperature, and package fit

The commercial temperature grade (0 °C to 70 °C) limits deployment to indoor, temperature-controlled environments; no industrial or automotive temperature range is offered on this variant. Packaged in a 100-TQFP (14x20 mm body, 0.5 mm pitch). The footprint matches the standard 100-pin LQFP/TQFP land pattern — the thermal pad on the underside should be connected to a ground plane for heat spreading, though the 9 Mbit density keeps the junction temperature well below the 70 °C ambient ceiling in normal airflow.

Frequently asked questions

What is the memory organization and interface of CY7C1354C-200AXC?

It is a 9 Mbit synchronous SRAM organized 256K x 36 with a parallel interface and a 200 MHz clock. The NoBL architecture allows zero-latency read-to-write transitions.

What package does CY7C1354C-200AXC use?

The base package is a 100-LQFP.