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Infineon Technologies CY7C1321KV18-333BZC — Memory (DRAM / SRAM / Flash / EEPROM)

Cypress CY7C1321KV18-333BZC SRAM, 18Mbit, 333 MHz, 165-FBGA

MPNCY7C1321KV18-333BZC
Obsolete

Cypress CY7C1321KV18-333BZC, Synchronous DDR II SRAM, 18Mbit (512K x 36), 333 MHz clock, Parallel interface, 1.7V-1.9V supply, 165-FBGA (13x15 mm), 0°C to 70°C.

$28.3200Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

CY7C1321KV18-333BZC Technical Specifications
ParameterValue
Memory typeVolatile
Mounting typeSurface Mount
Voltage1.7V ~ 1.9V
Frequency333 MHz
Memory interfaceParallel
Operating temperature0°C~70°C(TA)
PackageTray
TechnologySRAM - Synchronous, DDR II
Memory size18Mbit
Memory formatSRAM
Case165-LBGA
Memory organization512K x 36

Product details

Obsolete — sourcing reality

The CY7C1321KV18-333BZC is officially listed as Obsolete by Cypress (now Infineon). No last-time-buy window remains open. For a BOM line that needs this exact order code, the only channel is the independent surplus and broker market.

Package and temperature grade

The 165-ball FBGA (13x15 mm) is a fine-pitch BGA. The commercial temperature range (0°C to 70°C) limits this variant to indoor, climate-controlled equipment.

Frequently asked questions

What is the closest pin-compatible alternative to CY7C1321KV18-333BZC?

The CY7C1321KV18-333BZXI is the industrial-temperature (-40°C to 85°C) variant in the same 165-FBGA package, but it is also obsolete. No active drop-in replacement exists from Cypress/Infineon. A board redesign to a current-generation QDR or RLDRAM is the recommended path for new designs.

What is CY7C1321KV18-333BZC's listed package?

The part is supplied in a Tray and packaged in a 165-ball LBGA (13x15 mm body, 165-FBGA supplier device package).

What is CY7C1321KV18-333BZC's listed technology?

It is a Synchronous DDR II SRAM, volatile memory, organized as 512K x 36.