250 MHz DDR II+ SRAM for high-throughput buffer applications
This is a second-generation double-data-rate SRAM with a pipelined read/write architecture, used in high-bandwidth networking buffers, test equipment, and signal-processing pipelines where deterministic latency and full bus utilization are required.
Obsolete — plan your last-time buy or second-source now
This means the manufacturer has discontinued production and no further last-time-buy windows are available through the authorized channel. Any remaining stock in the independent distribution chain is finite. If you have an active BOM line using this part, the procurement decision is immediate: secure existing inventory or qualify a replacement.
Package and handling for the 165-FBGA
The 165-ball FBGA (13x15 mm) footprint is a standard fine-pitch BGA. The 1.7V–1.9V supply rail is narrow — a 1.8V ±5% regulator is the typical choice, and the PCB stack-up must keep impedance-controlled traces for the 250 MHz clock and data lines.
What the 250 MHz clock and 512K x 36 organization mean for the bus
The 250 MHz clock rate delivers a peak data rate of 18 Gbit/s on a 36-bit wide bus (double-data-rate transfers). For a networking packet buffer or a test-instrument capture memory, this keeps up with 10 GbE line rates and high-speed ADC streams without wait states. The 512K depth per word gives 2 MB of storage in a single chip, enough for moderate-size FIFO or look-up-table applications. The DDR II+ interface eliminates dead cycles between read and write turns, so back-to-back throughput is the same as the clock rate — no bus-turnaround penalty.