Obsolete DDR II SRAM — sourcing reality
The CY7C1320BV18-167BZCT: Built on the 18 Mbit DDR II SRAM architecture, it runs at 167 MHz clock with a 512K x 36 organization — a 36-bit wide word that suits wide-bus applications like network switch buffers or ASIC cache where a single chip covers the full data path.
Package and supply — board-fit details
Housed in a 165-ball LBGA, the supplier device package is the 165-FBGA (13x15 mm). This is a fine-pitch BGA — the 0.80 mm ball pitch demands a controlled-impedance PCB with at least four layers for fan-out; two-layer boards will not route the inner rows. Supply voltage is 1.7 V to 1.9 V, a low-voltage core typical of DDR-II I/O. Tape & Reel packaging supports automated assembly, but the BGA footprint means rework requires a hot-air station or reflow oven — not a field-swap part for a technician's kit.