The CY7C1318BV18-167BZC from Infineon (formerly Cypress) is a 18Mbit synchronous DDR-II SRAM organized as 1M x 18 bits. It clocks at 167 MHz with a parallel interface, delivering double-data-rate transfers on both edges of the clock for high-bandwidth buffer applications — typically network packet processing, base station line cards, or test equipment where low-latency temporary storage is critical.
167 MHz clock and DDR-II bus — what the speed rating buys you
At 167 MHz, the DDR-II interface transfers data at 333 MT/s per pin. For an 18-bit-wide bus, that yields roughly 6 Gbit/s raw bandwidth — enough to feed a high-end FPGA or network processor without stalling. The synchronous architecture eliminates the dead cycles associated with asynchronous SRAM, so back-to-back reads and writes sustain full throughput. If your design needs higher density or a wider bus, the CY7C1318 family includes 36Mbit and x36 variants, but the footprint and supply voltage differ — verify compatibility before swapping.
Infineon lists the CY7C1318BV18-167BZC as obsolete. If you are qualifying a replacement, expect to evaluate a pin-compatible DDR-II SRAM from another vendor with the same 165-FBGA footprint and 1.8V supply; the base product number CY7C1318 may have later speed or temperature variants still active, but the -167BZC suffix specifically is end-of-life.
165-FBGA footprint and layout notes
The 165-ball FBGA measures 13x15 mm with a 1.0 mm ball pitch. Surface-mount reflow requires a standard lead-free profile; the package is moisture-sensitive, so a bake may be needed if the tray seal is broken. Decoupling should follow the datasheet recommendation — typically a 0.1 µF ceramic per supply pin plus a bulk 10 µF on the board. The narrow 1.7V to 1.9V supply range means the 1.8V rail must be well-regulated; a 3% tolerance regulator keeps the SRAM inside its operating window.