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Infineon Technologies CY7C1314KV18-333BZC — Memory (DRAM / SRAM / Flash / EEPROM)

Cypress CY7C1314KV18-333BZC QDR II SRAM, 18 Mbit, 333 MHz

MPNCY7C1314KV18-333BZC
Obsolete

Cypress CY7C1314KV18-333BZC, QDR II synchronous SRAM, 18 Mbit, 333 MHz clock, 512K x 36 organization, 1.7V–1.9V supply, 165-ball FBGA (13x15 mm), commercial temperature 0°C to 70°C.

$28.3200Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

CY7C1314KV18-333BZC specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Supply voltage1.7V ~ 1.9V
Clock frequency333 MHz
Memory interfaceParallel
Operating temperature0°C~70°C(TA)
PackageTray
TechnologySRAM - Synchronous, QDR II
Memory size18Mbit
Memory formatSRAM
Case165-LBGA
Memory organization512K x 36

Product details

Obsolete — what it means for sourcing

No last-time-buy window remains — the part is no longer available through the factory. Sourcing shifts entirely to the independent market: surplus inventory, broker channels, and verified stock from distribution partners who hold legacy SRAM.

The CY7C1314KV18-333BZC is a 18 Mbit synchronous SRAM using the QDR II (Quad Data Rate II) architecture. The memory is organized as 512K x 36, giving a 36-bit wide data bus that suits high-throughput applications like network packet buffers, cache memory for ASICs or FPGAs, and telecom line cards. The 333 MHz clock frequency means the device delivers a peak bandwidth of roughly 2.4 GB/s (333 MHz x 36 bits x 2 for DDR reads/writes, accounting for the separate read and write ports). That bandwidth matters when the design needs sustained back-to-back transactions without dead cycles — QDR II eliminates the bus-turnaround penalty of traditional SRAM by using dedicated read and write ports. The supply range is 1.7V to 1.9V, which aligns with 1.8V nominal core logic; the 165-ball FBGA (13x15 mm) footprint requires a multi-layer PCB with careful signal-integrity routing for the high-speed bus.

Package and temperature grade — design constraints

The 165-ball FBGA (13x15 mm) package is a fine-pitch BGA.

Frequently asked questions

Is CY7C1314KV18-333BZC obsolete?

Yes, the CY7C1314KV18-333BZC is listed as Obsolete by Cypress (Infineon). It is no longer in production and has no factory last-time-buy window. Sourcing is through independent distribution and surplus stock.