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Infineon Technologies CY7C1313CV18-200BZXI — Memory (DRAM / SRAM / Flash / EEPROM)

CY7C1313CV18-200BZXI QDR II SRAM, 18Mbit, 200 MHz, 165-FBGA

MPNCY7C1313CV18-200BZXI
Obsolete

Infineon Technologies CY7C1313CV18-200BZXI QDR II SRAM, 18Mbit (1M x 18), 200 MHz, 1.7V-1.9V, -40°C to +85°C, 165-FBGA (13x15 mm), Tray.

$29.4600Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

CY7C1313CV18-200BZXI specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Supply voltage1.7V ~ 1.9V
Clock frequency200 MHz
Memory interfaceParallel
Operating temperature-40°C~85°C(TA)
PackageTray
TechnologySRAM - Synchronous, QDR II
Memory size18Mbit
Memory formatSRAM
Case165-LBGA
Memory organization1M x 18

Product details

18 Mbit QDR II at 200 MHz — the line-rate ceiling

The CY7C1313CV18-200BZXI is a 18 Mbit QDR II SRAM organized 1M x 18, clocked at 200 MHz. At this speed, the read and write ports each deliver 400 MB/s of theoretical bandwidth — the limiting factor in a backplane or line-card buffer is the FPGA or ASIC interface timing, not the memory itself. Supply voltage is 1.7V to 1.9V, so a single 1.8V rail with ±100 mV tolerance powers the core — no separate VDDQ. The parallel interface uses separate read and write data buses, which doubles throughput per clock cycle compared to a common-I/O SRAM.

Industrial temp and FBGA footprint

The package ships in Tray format, which is standard for low-volume production and prototyping — no reel fee or tape-and-reel minimum to absorb.

Infineon lists the CY7C1313CV18-200BZXI as Obsolete. For a BOM that already carries this part number, the procurement decision is whether to secure a last-time-buy quantity or qualify a functional replacement. The 165-FBGA footprint and 1.8V core are common across the QDR II family, but a direct drop-in without a board spin is not guaranteed.

Frequently asked questions

What package does CY7C1313CV18-200BZXI use?

165-ball FBGA (13x15 mm), 1.0 mm ball pitch. The supplier device package is 165-FBGA (13x15). Ships in Tray format.

What is the memory organization and clock speed?

18 Mbit organized 1M x 18, clocked at 200 MHz. It is a QDR II synchronous SRAM with a parallel interface.

What temperature range does this SRAM support?

Industrial temperature range: -40°C to +85°C (TA).