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Infineon Technologies CY7C1312KV18-300BZC — Memory (DRAM / SRAM / Flash / EEPROM)

CY7C1312KV18-300BZC QDR II SRAM 18Mbit 300 MHz 165-FBGA

MPNCY7C1312KV18-300BZC
Last Buy

Infineon CY7C1312KV18-300BZC, QDR II synchronous SRAM, 18Mbit (1M x 18), 300 MHz clock, parallel interface, 1.7V–1.9V supply, 165-FBGA (13x15 mm), 0°C to 70°C.

$30.8500Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

CY7C1312KV18-300BZC specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Supply voltage1.7V ~ 1.9V
Clock frequency300 MHz
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageTray
TechnologySRAM - Synchronous, QDR II
Memory size18Mbit
Memory formatSRAM
Case165-LBGA
Memory organization1M x 18

Product details

18 Mbit QDR II SRAM at 300 MHz — what the clock rate buys you

The CY7C1312KV18-300BZC is a 18 Mbit synchronous SRAM from Infineon (formerly Cypress) using the QDR II architecture. It is organized as 1M x 18 and clocks at 300 MHz, delivering a peak read-write bandwidth that suits high-throughput buffer applications — network packet processing, test equipment frame buffers, or cache memory in FPGA-based designs where the bus must sustain back-to-back transactions without dead cycles. The QDR II interface separates read and write data ports, so the controller can issue a read and a write on every rising clock edge, effectively doubling throughput versus a common I/O SRAM at the same frequency.

Last Buy — plan the LTB order now

That means Infineon has issued a final purchase window — once the last-time-buy date passes, the part will no longer be manufactured. The 165-FBGA footprint is shared with other QDR II densities in the family, so a drop-in replacement may exist at a different memory size, but that requires board-level validation.

165-FBGA — footprint and rework notes

The package is a 165-ball FBGA, 13 x 15 mm body, surface-mount only. For rework, a bottom-side preheat profile that keeps the junction below 220°C is standard; the 0.8 mm ball pitch allows visual alignment with X-ray inspection afterward.

Frequently asked questions

Is CY7C1312KV18-300BZC obsolete?

The part is not yet obsolete but is in Last Buy status — Infineon has announced a final purchase window. Once that window closes, no further production will occur. Plan a lifetime buy or qualify an alternative before the cutoff.

What is the replacement for CY7C1312KV18-300BZC?

The closest functional peer in the same QDR II family is the CY7C1415KV18-300BZXC, which doubles the density to 36 Mbit (1M x 36) at the same 300 MHz clock in a similar FBGA package — but the wider data bus and different footprint require board-level validation before substitution.