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Infineon Technologies CY7C1270KV18-400BZXC — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon CY7C1270KV18-400BZXC 36Mbit DDR II+ SRAM, 400 MHz

MPNCY7C1270KV18-400BZXC
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Infineon Technologies CY7C1270KV18-400BZXC, synchronous DDR II+ SRAM, 36Mbit, 1M x 36 organization, 400 MHz clock, 1.7V–1.9V supply, 165-LBGA tray package, 0°C–70°C.

$49.8376Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CY7C1270KV18-400BZXC specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Supply voltage1.7V ~ 1.9V
Clock frequency400 MHz
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageTray
TechnologySRAM - Synchronous, DDR II+
Memory size36Mbit
Memory formatSRAM
Case165-LBGA
Memory organization1M x 36

Product details

36Mbit DDR II+ SRAM at 400 MHz — bandwidth and bus fit

The CY7C1270KV18-400BZXC is a 36Mbit synchronous DDR II+ SRAM organized as 1M x 36, clocked at 400 MHz. The DDR II+ interface delivers data on both clock edges, so the effective data rate is 800 MT/s per I/O pin — the 36-bit-wide bus sustains 28.8 Gbit/s raw throughput, which sets the bandwidth ceiling for the buffer or cache it feeds. The 1.7V–1.9V supply rail keeps the core power draw in check for a 400 MHz synchronous part, but the I/O bank also runs at the same VDDQ — no separate I/O voltage, so the supply rail must be shared cleanly with the controller. Operating temperature is 0°C–70°C (commercial grade), which covers most indoor networking and compute equipment but not extended industrial or automotive environments.

Package and board-fit — 165-FBGA landing pattern

The part ships in a 165-ball LBGA (13x15 mm body per the supplier device package designation). The tray packaging means the parts are delivered in JEDEC trays, not tape-and-reel, so the pick-and-place feeder setup expects a tray handler or waffle-pack adapter.

Frequently asked questions

What is the memory organization and clock speed of CY7C1270KV18-400BZXC?

It is a 36Mbit synchronous DDR II+ SRAM organized as 1M x 36, clocked at 400 MHz. The DDR II+ interface transfers data on both edges, giving an effective 800 MT/s per pin and a 28.8 Gbit/s aggregate bus bandwidth.

What package does CY7C1270KV18-400BZXC use and how is it supplied?

The part is housed in a 165-ball LBGA (13x15 mm body) and supplied in JEDEC trays, not tape-and-reel. The 1.0 mm ball pitch is compatible with standard four-layer PCB fan-out with via-in-pad techniques.