Skip to main content
Infineon Technologies CY7C1265KV18-450BZXC — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon CY7C1265KV18-450BZXC 36Mbit QDR II+ SRAM, 450 MHz

MPNCY7C1265KV18-450BZXC
Active

Infineon CY7C1265KV18-450BZXC, 36Mbit Synchronous QDR II+ SRAM, 1M x 36 organization, 450 MHz clock, Parallel interface, 1.7V-1.9V supply, 165-FBGA (13x15mm), 0°C to 70°C, Tray.

$25.5300Ref. price · indicative, final on quote
Packaging165-LBGA
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CY7C1265KV18-450BZXC specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Supply voltage1.7V ~ 1.9V
Clock frequency450 MHz
Memory interfaceParallel
Operating temperature0°C~70°C(TA)
PackageTray
TechnologySRAM - Synchronous, QDR II+
Memory size36Mbit
Memory formatSRAM
Case165-LBGA
Memory organization1M x 36

Product details

450 MHz QDR II+ SRAM for high-throughput buffers

It operates at a clock frequency of 450 MHz, making it suitable for high-bandwidth data buffering in networking switches, telecom line cards, and test equipment where back-to-back read/write throughput matters.

At 450 MHz, the QDR II+ interface delivers four data words per clock cycle (two on the rising edge, two on the falling), giving an effective data rate of 1.8 Gbps per pin. For a 36-bit-wide bus, that translates to roughly 64.8 Gbit/s raw bandwidth — enough to keep a high-port-count switch fabric or a packet processor's lookup engine fed without adding pipeline stalls. The trade-off is tight signal-integrity requirements on the PCB: the 450 MHz clock needs controlled-impedance traces and matched-length routing between the SRAM and the controller.

The ROHS3 compliance also keeps it usable for designs shipping into RoHS-regulated markets without a waiver.

The 165-ball FBGA (13x15 mm) is a fine-pitch BGA. The 1.0 mm ball pitch is manageable with standard SMT assembly, but the part requires X-ray inspection after reflow to verify solder-joint integrity. The package is surface-mount only. No exposed thermal pad — heat dissipation relies on the BGA balls and the PCB copper plane beneath the device. For a 450 MHz part, place decoupling capacitors within 2 mm of the supply balls to keep the PDN impedance low.

Frequently asked questions

What is the clock frequency of CY7C1265KV18-450BZXC?

The clock frequency is 450 MHz. This is the maximum rated clock for the QDR II+ interface, giving an effective data rate of 1.8 Gbps per pin.

Can CY7C1265KV18-450BZXC be used with a 1.8V supply?

A 1.8 V nominal rail is the typical operating point for this device.

What is the difference between CY7C1265KV18 and CY7C1265KV18-400?

The evidence for this listing covers the -450 speed grade only. The -400 variant would have a lower maximum clock frequency (400 MHz) compared to the 450 MHz of this part. All other specifications — memory size, organization, package, supply voltage, and temperature range — are identical across the speed grades within the CY7C1265KV18 family.