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Infineon Technologies CY7C1263XV18-633BZXC — Memory (DRAM / SRAM / Flash / EEPROM)

CY7C1263XV18-633BZXC Infineon 36Mbit QDR II+ SRAM, 633 MHz

MPNCY7C1263XV18-633BZXC
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Infineon Technologies CY7C1263XV18-633BZXC, 36Mbit synchronous QDR II+ SRAM, 633 MHz clock, 2M x 18 organization, parallel interface, 1.7-1.9V supply, 165-FBGA package, 0°C to 70°C commercial temperature.

$128.2750Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CY7C1263XV18-633BZXC specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Supply voltage1.7V ~ 1.9V
Clock frequency633 MHz
Memory interfaceParallel
Operating temperature0°C~70°C(TA)
PackageTray
TechnologySRAM - Synchronous, QDR II+
Memory size36Mbit
Memory formatSRAM
Case165-LBGA
Memory organization2M x 18

Product details

Active QDR II+ SRAM — 633 MHz, 36 Mbit

The CY7C1263XV18-633BZXC is a 36 Mbit synchronous SRAM built on the QDR II+ architecture, clocked at 633 MHz. Organized 2M x 18, it delivers a read and a write data word on every rising and falling clock edge — four data transfers per cycle — for a peak bandwidth that keeps a high-performance FPGA or ASIC's internal SRAM fed without wait states. The 165-FBGA package (13x15 mm) routes the parallel interface to a compact BGA footprint. The 1.7 V to 1.9 V core supply aligns with low-voltage 1.8 V logic families common on modern processor and FPGA boards.

Bandwidth and bus timing

At 633 MHz, the QDR II+ interface performs four data transfers per clock cycle — two reads and two writes — so the effective data rate per I/O pin is 2.5 Gbps. The 18-bit-wide data bus yields a theoretical peak throughput of 45 Gbit/s, limited by the I/O buffer drive strength and board trace impedance. The parallel memory interface uses separate read and write data ports, eliminating bus-turnaround dead cycles that plague common I/O designs. This matters for networking gear or real-time signal processing where back-to-back read-write sequences are the norm.

Temperature grade and supply rails

The 1.7 V to 1.9 V supply range includes the nominal 1.8 V rail with margin for ripple and DC offset. The 165-LBGA package (13x15 mm, 1.0 mm ball pitch) requires a multi-layer PCB with controlled-impedance traces for the high-speed parallel bus. The BGA footprint is standard for high-density memory; the 1.0 mm pitch is hand-solderable with a hot-air rework station and a stencil.

Frequently asked questions

What package does the CY7C1263XV18-633BZXC use?

It ships in a 165-LBGA / 165-FBGA (13 mm by 15 mm) tray package, which is a BGA footprint requiring board-level rework capability rather than hand soldering.