This class of memory is designed for high-bandwidth, low-latency applications such as network switches, telecom line cards, and high-end test equipment where back-to-back read/write throughput without dead cycles is essential.
No last-time-buy window is indicated in the available record. The 165-ball FBGA package and 400 MHz speed grade narrow the pool of available units, so lead time and pricing are confirmed only at quote time against a specific quantity request.
The 400 MHz clock rate defines the peak data bandwidth: with QDR II's dual-port architecture, the part can sustain up to 800 million data transfers per second on each port (read and write simultaneously).
Package and mounting — 165-ball FBGA
Housed in a 165-ball LBGA (supplier device package 165-FBGA, 15x17 mm), this is a surface-mount BGA with a 1.0 mm ball pitch typical of high-density SRAM packages. The tray shipping medium is standard for BGA devices in prototype and low-volume production.
