It clocks at 400 MHz and is organized as 1M x 36, meaning each access moves 36 bits in parallel. This part is designed for high-throughput data buffers: network packet processors, search engines, and DSP pipelines where back-to-back reads and writes saturate a traditional shared-bus SRAM.
The 400 MHz clock rate means the memory interface toggles at 400 MT/s per pin on the read and write ports independently.
Package reality — 165-ball FBGA, no socket
The CY7C1245KV18-400BZXC comes in a 165-ball FBGA — 13 mm × 15 mm body, 1.0 mm ball pitch. That is a hand-solderable pitch with a hot-air rework station, but not socketable. The supplier device package is 165-FBGA (13x15). The tray shipping medium means parts arrive in a JEDEC tray, not tape-and-reel; plan for pick-and-place nozzle changeover if the line is set up for tape feeders.
That is a standard commercial range. If your ambient floor drops below freezing — outdoor telecom cabinets, unheated enclosures, cold-chain logistics — this part will not meet the datasheet specification below 0°C. The storage temperature range is not given, but the operating range is the binding constraint for production shipments.