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Infineon Technologies CY7C1170KV18-550BZC — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon CY7C1170KV18-550BZC SRAM, 18Mbit, 550 MHz, DDR II+

MPNCY7C1170KV18-550BZC
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Infineon CY7C1170KV18-550BZC, 18Mbit Synchronous SRAM, DDR II+, 550 MHz, 512K x 36, Parallel, 1.7V-1.9V, 165-FBGA (13x15 mm), 0°C to 70°C.

$56.9000Ref. price · indicative, final on quote
Infineon Technologies CY7C1170KV18-550BZC datasheet (PDF)
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CY7C1170KV18-550BZC specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Supply voltage1.7V ~ 1.9V
Clock frequency550 MHz
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageTray
TechnologySRAM - Synchronous, DDR II+
Memory size18Mbit
Memory formatSRAM
Case165-LBGA
Memory organization512K x 36

Product details

The Infineon CY7C1170KV18-550BZC is a 18 Mbit synchronous SRAM organised as 512K x 36, using DDR II+ (Double Data Rate II+) architecture. It runs at a 550 MHz clock, delivering back-to-back read/write throughput without dead cycles on a 36-bit parallel bus. The 1.7 V to 1.9 V supply and 165-ball FBGA package (13x15 mm) target high-bandwidth networking, telecom line cards, and DSP memory subsystems where wide-word access and low-latency matter.

At 550 MHz the DDR II+ interface transfers data on both clock edges. The 512K x 36 organisation moves 36 bits in parallel per access.

Package and temperature — board-level constraints

Storage temperature exceeds the operating range, but the part is not rated for condensation or extended thermal cycling outside the commercial window.

Frequently asked questions

What is the package type for CY7C1170KV18-550BZC?

It comes in a 165-ball FBGA (13x15 mm) package, supplied in tray format.

What is the memory technology of CY7C1170KV18-550BZC?

It is a volatile synchronous SRAM using DDR II+ (Double Data Rate II+) architecture with a parallel interface.

Will CY7C1170KV18-550BZC drop into a board designed for CY7C1265XV18-633BZXC?

Both parts share a 165-ball FBGA footprint and a 1.7 V to 1.9 V supply, but the CY7C1265XV18-633BZXC has a different ball map and a 633 MHz clock. Verify the PCB layout and timing constraints before substitution.