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Infineon Technologies CY7C1170KV18-400BZXC — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon CY7C1170KV18-400BZXC 18Mbit DDR II+ SRAM, 400 MHz

MPNCY7C1170KV18-400BZXC
Obsolete

Infineon CY7C1170KV18-400BZXC, 18Mbit synchronous DDR II+ SRAM, 512K x 36 organization, 400 MHz clock, 1.7–1.9 V supply, 165-LBGA tray package, 0°C to 70°C operating temperature, obsolete.

Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

CY7C1170KV18-400BZXC specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Supply voltage1.7V ~ 1.9V
Clock frequency400 MHz
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageTray
TechnologySRAM - Synchronous, DDR II+
Memory size18Mbit
Memory formatSRAM
Case165-LBGA
Memory organization512K x 36

Product details

400 MHz DDR II+ — what the speed grade buys you

The CY7C1170KV18-400BZXC is a 18Mbit synchronous SRAM from Infineon using a DDR II+ interface — double-data-rate on both clock edges at a 400 MHz clock frequency. That gives an effective data rate of 800 MT/s per pin over a 36-bit-wide bus (512K x 36 organization). The part is volatile, parallel-interface, and optimized for high-throughput cache or buffer applications where a QDR-style part would be overkill but standard sync SRAM leaves bandwidth on the table.

Infineon lists the CY7C1170KV18-400BZXC as obsolete.

Package and temperature — board-fit constraints

Surface-mount only. That rules out outdoor telecom cabinets, engine bays, or any environment where the junction sees sustained temperatures above 70°C.

Frequently asked questions

Is CY7C1170KV18-400BZXC obsolete?

Yes, Infineon has marked the CY7C1170KV18-400BZXC as obsolete. No official replacement part number has been published.

What are the alternatives to CY7C1170KV18-400BZXC?

No pin-compatible or drop-in replacement is listed by Infineon. For a new design, consider a current-generation DDR II+ or QDR SRAM from the same density and speed class, but verify the footprint and timing parameters — the 165-FBGA layout and 400 MHz clock rate are specific to this part. The CY7C1170 base number covers multiple speed and temperature variants; a cross-reference through Infineon's parametric search is the next step.

What package does CY7C1170KV18-400BZXC use?

The CY7C1170KV18-400BZXC is supplied in a 165-ball LBGA (low-profile ball grid array), also described as a 165-FBGA with a 13x15 mm body. The shipping medium is tray.