400 MHz clock — timing margin and throughput
Clock frequency is 400 MHz. Package is 165-FBGA (13x15 mm).
512K x 36 organization — why the width matters
Memory organization is 512K x 36. Package is 165-FBGA (13x15 mm).

Infineon CY7C1170KV18-400BZC, 18Mbit Synchronous DDR II+ SRAM, 400 MHz clock, 512K x 36 organization, Parallel interface, 1.7V–1.9V supply, 165-FBGA (13x15 mm), 0°C to 70°C operating temperature.
| Parameter | Value |
|---|---|
| Memory type | Volatile |
| Mounting | Surface Mount |
| Supply voltage | 1.7V ~ 1.9V |
| Clock frequency | 400 MHz |
| Memory interface | Parallel |
| Operating temperature | 0°C ~ 70°C (TA) |
| Package | Tray |
| Technology | SRAM - Synchronous, DDR II+ |
| Memory size | 18Mbit |
| Memory format | SRAM |
| Case | 165-LBGA |
| Memory organization | 512K x 36 |
Clock frequency is 400 MHz. Package is 165-FBGA (13x15 mm).
Memory organization is 512K x 36. Package is 165-FBGA (13x15 mm).
Yes, the CY7C1170KV18-400BZC is in Last Buy status — Infineon has announced end-of-life and is accepting final orders within a defined window. After that window closes, no further production will occur.
No official successor order code is listed in the lifecycle record. A direct pin-compatible replacement from Infineon is not documented. Sourcing through independent distribution is the current path for this part.
Yes, the supply range is 1.7V to 1.9V, so a nominal 1.8V rail is within spec. The part is designed for low-voltage operation at that level.
The package is a 165-ball FBGA (Fine-Pitch Ball Grid Array) measuring 13x15 mm. The supplier device package is 165-FBGA (13x15). It is surface-mount only.