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Infineon Technologies CY7C1150KV18-400BZC — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon CY7C1150KV18-400BZC 18Mbit DDR II+ SRAM, 400 MHz

MPNCY7C1150KV18-400BZC
End of Life

Infineon CY7C1150KV18-400BZC, 18Mbit Synchronous SRAM - DDR II+, 512K x 36, 400 MHz clock, 1.7V–1.9V supply, 165-FBGA (13x15 mm), 0°C to 70°C, Tray.

$33.7600Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CY7C1150KV18-400BZC specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Supply voltage1.7V ~ 1.9V
Clock frequency400 MHz
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageTray
TechnologySRAM - Synchronous, DDR II+
Memory size18Mbit
Memory formatSRAM
Case165-LBGA
Memory organization512K x 36

Product details

The Infineon CY7C1150KV18-400BZC is a 18 Mbit synchronous SRAM using a DDR II+ (double-data-rate, second-generation-plus) interface, organized as 512K words by 36 bits. It clocks at 400 MHz, delivering back-to-back read/write transactions on every clock edge — the DDR II+ protocol eliminates dead cycles on the bus, so the controller sees full-rate throughput without wait states. This part targets high-bandwidth, latency-sensitive buffers: network switch lookup tables, telecom line-card packet memories, and high-end FPGA co-processing where a wide 36-bit word matches internal data-path widths.

400 MHz clock — the bus timing reality

At 400 MHz the DDR II+ interface toggles data on both edges, so the effective data rate is 800 MT/s per pin. For a 36-bit-wide bus that's 3.2 GB/s peak. The 165-ball FBGA (13x15 mm) keeps signal lengths short, but the layout engineer needs to match trace lengths within a few hundred mils and keep the clock-to-strobe skew tight.

That's a ±5.6% window — tighter than a typical 1.8 V ±10% LDO. If the rail droops below 1.7 V during a burst read, the SRAM may lose data or corrupt the bus. Pick a regulator with at least 1% initial accuracy and good transient response; a 1.8 V fixed-output LDO with 300 mV dropout at the load current works. Don't pull this rail from a shared 1.8 V supply that also feeds noisy digital logic — the SRAM's supply needs its own local decoupling.

For BOM planning, this part presents no single-source risk; Infineon continues to manufacture it.

Frequently asked questions

CY7C1150KV18-400BZC vs CY7C1151KV18: what's the difference?

Both are 18 Mbit DDR II+ SRAMs in the same 165-FBGA package and supply range. The CY7C1150KV18 is organized as 512K x 36; the CY7C1151KV18 uses a different organization (typically 1M x 18). Check your bus width requirement — the 36-bit word of the CY7C1150KV18 suits wide data-path designs, while the 18-bit version halves the pin count on the data bus.