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Infineon Technologies CY7C1145KV18-400BZXCT — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon CY7C1145KV18-400BZXCT QDR II+ SRAM, 18Mbit, 400 MHz

MPNCY7C1145KV18-400BZXCT
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Infineon Technologies CY7C1145KV18-400BZXCT synchronous SRAM, QDR II+ architecture, 18Mbit (512K x 36), 400 MHz clock, 1.7V-1.9V, 165-FBGA, Tape & Reel.

$44.9925Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CY7C1145KV18-400BZXCT specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Supply voltage1.7V ~ 1.9V
Clock frequency400 MHz
Memory interfaceParallel
Operating temperature0°C~70°C(TA)
PackageTape & Reel (TR)
TechnologySRAM - Synchronous, QDR II+
Memory size18Mbit
Memory formatSRAM
Case165-LBGA
Memory organization512K x 36

Product details

QDR II+ architecture at 400 MHz — what the clock rate buys you

The CY7C1145KV18-400BZXCT: This is a QDR II+ (Quad Data Rate II+) synchronous SRAM, a class designed for the highest-throughput memory interfaces in networking, telecom, and test equipment. The 400 MHz clock drives a data rate of 800 MHz per pin on the read and write ports because QDR II+ transfers data on both clock edges. For a system architect, that translates to a peak read bandwidth of roughly 3.2 GB/s across the 36-bit word — enough to keep a 100 GbE packet processor fed without wait states.

18 Mbit density — 512K x 36 organization

The memory is organized as 512K words of 36 bits each, for a total of 18 Mbit. The 36-bit word width is common in applications that need a 32-bit data bus plus parity or ECC overhead without an extra chip. The 512K depth is modest by today's DRAM standards, but for an SRAM at this speed grade it is a typical density — the trade-off is access time vs capacity.

Supply and temperature — power domain and environment

The supply range is 1.7 V to 1.9 V, a narrow window that demands a clean, regulated rail — a 1.8 V LDO or switching regulator with tight load regulation is the typical choice. This limits deployment to indoor, controlled environments; it is not rated for industrial or automotive ambient extremes.

Package — 165-ball FBGA, 13x15 mm

Housed in a 165-ball LBGA, the supplier device package is a 165-FBGA measuring 13x15 mm. The fine-pitch BGA requires a multi-layer PCB with via-in-pad or microvia fan-out for the inner rows. The Tape & Reel packaging is the standard for automated assembly — the reel quantity is confirmed at quote time.

Frequently asked questions

How do I get current pricing and availability for CY7C1145KV18-400BZXCT?

Submit an RFQ through this listing. The part is sourced to order through independent and authorized distribution; current pricing, lead time, and stock position are confirmed at quote time.