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Infineon Technologies CY7C1079DV33-12BAXIT — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon CY7C1079DV33-12BAXIT 32Mbit Async SRAM, 12 ns

MPNCY7C1079DV33-12BAXIT
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Infineon CY7C1079DV33-12BAXIT, 32Mbit Asynchronous SRAM, 4M x 8 organization, 12 ns access time, 3V to 3.6V supply, -40°C to 85°C, 48-FBGA (8x9.5mm), Tape & Reel.

$90.2750Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CY7C1079DV33-12BAXIT specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Supply voltage3V ~ 3.6V
Memory interfaceParallel
Operating temperature-40°C ~ 85°C (TA)
PackageTape & Reel (TR)
TechnologySRAM - Asynchronous
Access time12 ns
Memory size32Mbit
Memory formatSRAM
Case48-TFBGA
Memory organization4M x 8
Write cycle time - word, page12ns

Product details

32Mbit asynchronous SRAM for industrial and telecom systems

The 12 ns access time means the host processor can complete a read or write cycle in a single bus transaction at clock rates up to roughly 83 MHz, assuming zero wait states — a common fit for 66 MHz and 80 MHz buses on older PowerPC, ARM9, or x86 embedded controllers that still use a byte-wide parallel SRAM interface.

12 ns access time — timing margin on the bus

The 12 ns access time and 12 ns write cycle time are the same figure, which simplifies the timing budget: the part can sustain back-to-back reads or writes at a 12 ns cycle period. For a system architect sizing the memory bus, that 12 ns window includes address setup, chip-select propagation, and data-out valid. On a 66 MHz bus (15 ns period), the 12 ns access leaves 3 ns of margin for PCB trace delay and buffer skew — tight but workable with careful layout. The write cycle time being identical to the read access means the controller does not need separate wait-state configurations for read versus write transactions.

48-ball FBGA — footprint and rework considerations

The part comes in a 48-ball FBGA (8x9.5 mm) with a 0.8 mm ball pitch typical of this density class.

For a procurement buyer qualifying this into a production BOM, there is no last-time-buy deadline to track. The part is the tape-and-reel ordering code (the 'T' suffix), which is the preferred format for automated pick-and-place assembly lines. The tray variant (-12BAXI) is the same silicon in a different shipping medium, so the BOM can specify either depending on the assembly house's feeder preference.

Frequently asked questions

Is CY7C1079DV33-12BAXIT obsolete or end-of-life?

It remains a current product from Infineon.

What are the exact specifications of CY7C1079DV33-12BAXIT?

The memory interface is parallel, and it comes in a 48-ball FBGA (8x9.5 mm) package on tape and reel.

Is CY7C1079DV33-12BAXIT available in tape and reel packaging?

Yes, the 'T' suffix in the ordering code indicates tape and reel packaging. The base part number CY7C1079DV33-12BAXI is the tray version; the -12BAXIT is the tape-and-reel variant for automated assembly.