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Infineon Technologies CY7C1061GN30-10BVXIT — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon CY7C1061GN30-10BVXIT 16Mbit Async SRAM, 10 ns

MPNCY7C1061GN30-10BVXIT
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Infineon CY7C1061GN30-10BVXIT, asynchronous SRAM, 16Mbit (1M x 16), 10 ns access time, parallel interface, 2.2V–3.6V supply, -40°C to 85°C, 48-VFBGA (6x8 mm), Tape & Reel.

$58.7475Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CY7C1061GN30-10BVXIT specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Supply voltage2.2V ~ 3.6V
Memory interfaceParallel
Operating temperature-40°C~85°C(TA)
PackageTape & Reel (TR)
TechnologySRAM - Asynchronous
Access time10 ns
Memory size16Mbit
Memory formatSRAM
Case48-VFBGA
Memory organization1M x 16
Write cycle time - word, page10ns

Product details

10 ns asynchronous SRAM for industrial memory subsystems

It operates from a 2.2V to 3.6V supply, making it compatible with both 2.5V and 3.3V logic families without external level shifters. The parallel interface is straightforward to route on a PCB, and the 48-VFBGA (6x8 mm) footprint keeps the board area compact.

10 ns access — what it buys the timing budget

In practice, this gives the designer headroom when routing the address and data buses across a board: trace delays, capacitive loading from multiple memory banks, and setup/hold requirements of the host controller all eat into the timing budget. With a 10 ns part, you can often avoid adding pipeline registers or slowing the system clock.

That covers cold-start at -40°C in an outdoor cabinet and the self-heating inside a sealed enclosure on a factory floor. The 2.2V to 3.6V supply range means the part can run from a 2.5V rail (common in low-power FPGA designs) or a 3.3V rail (standard for legacy processor buses) without a separate regulator. The 1M x 16 organization is well suited for 16-bit data buses, giving a single-chip memory solution for many MCU and DSP applications.

Surface-mount assembly is standard, but the small ball size means the PCB pad design and solder-paste volume need to be controlled to avoid head-in-pillow defects.

For a production BOM this removes the risk of a sudden last-time-buy.

Frequently asked questions

What is the equivalent replacement for CY7C1061GN30-10BVXIT?

Any such candidate would need to be qualified on timing, footprint, and temperature grade before substitution.