CY7C1061GE30-10BVXI

Infineon Technologies

Infineon Technologies CY7C1061GE30-10BVXI asynchronous SRAM, 16Mbit (1M x 16), 10 ns access time, parallel interface, 2.2V to 3.6V supply, -40°C to +85°C, 48-VFBGA (6x8 mm), Tray.

Infineon Technologies CY7C1061GE30-10BVXI
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Technical specifications

CY7C1061GE30-10BVXI specifications
Parameter / AttributeSpecification / Value
Memory typeVolatile
MountingSurface Mount
Supply voltage2.2V ~ 3.6V
Memory interfaceParallel
Operating temperature-40°C~85°C(TA)
PackageTray
TechnologySRAM - Asynchronous
Access time10 ns
Memory size16Mbit
Memory formatSRAM
Case48-VFBGA
Memory organization1M x 16
Write cycle time - word, page10ns

Technical details

Memory density and timing for the data path

The CY7C1061GE30-10BVXI is a 16 Mbit asynchronous SRAM organized as 1M x 16 bits, accessed through a parallel interface. The 10 ns access time and matching 10 ns write cycle time (word, page) mean the part can keep up with a processor bus running at 100 MHz without wait states — the data sheet's nominal timing is the ceiling for back-to-back reads. The wide range also gives headroom for a lightly regulated rail — the minimum 2.2 V is the dropout floor, not a recommendation to design at the edge.

Housed in a 48-ball VFBGA (6 x 8 mm body), the part uses a fine-pitch BGA footprint that requires a solder-paste stencil and reflow profile matched to the 0.5 mm ball pitch. The supplier device package is 48-VFBGA (6x8); the board land pattern should follow the JEDEC MO-225 registration for this package code. Surface-mount only — no through-hole variant exists for this density.

Temperature grade and environment

The 85°C ceiling is the ambient limit — junction temperature will be higher under active switching, but the 10 ns access time is specified across the full temperature band, not just at 25°C.

CY7C1061GE30-10BVXI
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