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Infineon Technologies CY7C1061GE18-15ZSXI — Memory (DRAM / SRAM / Flash / EEPROM)

Cypress CY7C1061GE18-15ZSXI 16Mbit Async SRAM, 15 ns

MPNCY7C1061GE18-15ZSXI
Last Buy

Cypress CY7C1061GE18-15ZSXI, 16Mbit asynchronous SRAM organized 1M x 16, 15 ns access time, 1.65 to 2.2 V supply, 54-TSOP II package, -40 to 85 °C.

$29.7304Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

CY7C1061GE18-15ZSXI specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Supply voltage1.65V ~ 2.2V
Memory interfaceParallel
Operating temperature-40°C ~ 85°C (TA)
PackageTray
TechnologySRAM - Asynchronous
Access time15 ns
Memory size16Mbit
Memory formatSRAM
Case54-TSOP (0.400\", 10.16mm Width)
Memory organization1M x 16
Write cycle time - word, page15ns

Product details

That access time is the spec that determines whether the memory can keep up with the bus controller without wait states — at 66 MHz a 15 ns window gives about one clock cycle of margin for address decode and data setup. At 100 MHz you are into the timing closure budget and may need to account for board trace delay. The 15 ns write cycle time matches the read access, so back-to-back transactions run at the same rate.

1.65 V to 2.2 V supply — low-voltage design fit

This SRAM runs from a 1.65 V to 2.2 V supply, which places it in the low-voltage memory tier for 1.8 V nominal core-logic designs. The 1.8 V domain also means lower dynamic power per access compared to 3.3 V asynchronous SRAMs of the same density.

Cypress (now Infineon) has announced the end of production; the final purchase window has passed or is closing. New- and surplus-stock through independent distribution is the remaining supply channel. If this SRAM is on your BOM, the procurement decision is about securing the remaining inventory before it dries up, or qualifying a pin-compatible alternative for long-term production.

54-TSOP II package — footprint and rework

The 54-TSOP II (0.400", 10.16 mm width) is a standard JEDEC thin small-outline package for high-density memories. Surface-mount only — no socket option. If the board needs rework, a hot-air station with a fine nozzle and a preheat plate is the usual approach; the 0.5 mm lead pitch demands careful alignment during hand placement.

Frequently asked questions

Where can I buy the CY7C1061GE18-15ZSXI and how do I get a price?

This part is sourced to order through independent distribution. Availability and current pricing are confirmed when you submit an RFQ — submit the full order code and required quantity and the desk will quote directly.