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Infineon Technologies CY7C1061GE-10BVJXIT — Memory (DRAM / SRAM / Flash / EEPROM)

Cypress CY7C1061GE-10BVJXIT 16Mbit Async SRAM, 10 ns

MPNCY7C1061GE-10BVJXIT
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Cypress CY7C1061GE-10BVJXIT, 16Mbit asynchronous SRAM, 1M x 16 organization, 10 ns access time, parallel interface, 4.5V–5.5V supply, -40°C to 85°C, 48-VFBGA (6x8 mm), Surface Mount, Tape & Reel.

$27.5000Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CY7C1061GE-10BVJXIT specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Supply voltage4.5V ~ 5.5V
Memory interfaceParallel
Operating temperature-40°C ~ 85°C (TA)
PackageTape & Reel (TR)
TechnologySRAM - Asynchronous
Access time10 ns
Memory size16Mbit
Memory formatSRAM
Case48-VFBGA
Memory organization1M x 16
Write cycle time - word, page10ns

Product details

The CY7C1061GE-10BVJXIT: This part is intended for high-speed cache, buffer, and scratchpad memory in systems where deterministic, cycle-by-cycle read/write access is required — think networking equipment, industrial controllers, test instrumentation, and legacy DSP farms that still run on a 5 V bus.

10 ns access — timing margin and bus fit

The 10 ns access time and 10 ns write cycle time are the headline numbers here. For a 16 Mbit asynchronous SRAM, 10 ns is in the fast tier — most density-equivalent parts from the same era run 12 ns or 15 ns. That 2 ns to 5 ns margin matters when the memory is on a shared bus with a fast CPLD or FPGA controller: it gives the address decode logic more slack before the data must be valid. The 1M x 16 organization is a 16-bit-wide data path, so a single chip serves a 16-bit microcontroller or a 32-bit processor in a 16-bit boot mode without external byte-lane muxing. The parallel interface is straightforward to route — no clock, no strobe sequencing — but the 48-VFBGA (6x8 mm) package demands a fine-pitch BGA layout with micro-vias or blind vias if the board is multilayer.

It is not a 3.3 V part, so if your system runs on 3.3 V logic, you need a level translator or a separate 5 V regulator for the memory bank. The 48-VFBGA package with a 6x8 mm body is a space-saver — roughly 25% smaller than a 44-pin TSOP II footprint — but the 0.5 mm or 0.65 mm ball pitch means the PCB fab needs at least a Class 3 capability for reliable solder joints.

That means no looming LTB risk for a production BOM. For dual-sourcing resilience, the base product number CY7C1061 covers multiple speed and package variants — the -10BVJXIT suffix denotes the 10 ns speed grade, the 48-VFBGA package, and the Tape & Reel carrier. If your layout can accommodate a 44-pin TSOP II, the CY7C1061 family includes that option, but the BGA variant is the one you have here.

Frequently asked questions

What is the lead time for CY7C1061GE-10BVJXIT?

Buyers need to plan production schedules and avoid delays.

Is CY7C1061GE-10BVJXIT a suitable replacement for CY7C1061GE-10BVJXI?

Engineers and buyers often need to verify compatibility when substituting parts.

What are the package dimensions of CY7C1061GE-10BVJXIT?

Design engineers need physical dimensions for PCB layout.

Can I purchase CY7C1061GE-10BVJXIT in cut tape or full reel quantities?

Sourcing buyers need to match purchasing quantity options to their bill of materials.

What is the maximum ambient temperature rating for CY7C1061GE-10BVJXIT?

Maintenance techs and design engineers need thermal specifications for reliability in harsh environments.

Is CY7C1061GE-10BVJXIT still in production or has it reached end of life?

Brokers and buyers need to avoid obsolete parts that could disrupt supply chains.