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Infineon Technologies CY7C1061G18-15BVXI — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon CY7C1061G18-15BVXI Async SRAM, 16Mbit, 15ns

MPNCY7C1061G18-15BVXI
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Infineon Technologies CY7C1061G18-15BVXI asynchronous SRAM, 16Mbit density, 1M x 16 organization, 15 ns access time, 1.65–2.2 V supply, 48-VFBGA package, -40 to 85 °C operating temperature.

$27.5000Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CY7C1061G18-15BVXI specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Supply voltage1.65V ~ 2.2V
Memory interfaceParallel
Operating temperature-40°C ~ 85°C (TA)
PackageTray
TechnologySRAM - Asynchronous
Access time15 ns
Memory size16Mbit
Memory formatSRAM
Case48-VFBGA
Memory organization1M x 16
Write cycle time - word, page15ns

Product details

16Mbit async SRAM — 15 ns access in a 1M x 16 bus

The CY7C1061G18-15BVXI: That 15 ns ceiling means the part can service back-to-back reads at roughly 66 MHz without wait states — a fit for cache, frame buffer, or scratchpad memory where deterministic latency matters more than sequential throughput.

Package and board-fit: 48-VFBGA (6x8 mm)

The small footprint saves board area versus a TSOP-II, but the BGA demands a multi-layer PCB with microvias for fan-out — a two-layer board will not route the full 16-bit data bus plus address lines.

Frequently asked questions

What package does CY7C1061G18-15BVXI use?

The part is supplied in a 48-ball VFBGA (Very Fine-pitch Ball Grid Array) with a 6x8 mm body, designated as supplier device package 48-VFBGA (6x8). It ships in Tray packaging.