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Infineon Technologies CY7C1051H30-10ZSXIT — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon CY7C1051H30-10ZSXIT SRAM, 8Mbit, 10 ns, 44-TSOP

MPNCY7C1051H30-10ZSXIT
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Infineon CY7C1051H30-10ZSXIT, asynchronous SRAM, 8Mbit (512K x 16), 10 ns access time, parallel interface, 2.2V to 3.6V supply, -40°C to 85°C, 44-TSOP II, Tape & Reel.

$15.6473Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CY7C1051H30-10ZSXIT specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Supply voltage2.2V ~ 3.6V
Memory interfaceParallel
Operating temperature-40°C ~ 85°C (TA)
PackageTape & Reel (TR)
TechnologySRAM - Asynchronous
Access time10 ns
Memory size8Mbit
Memory formatSRAM
Case44-TSOP (0.400\", 10.16mm Width)
Memory organization512K x 16
Write cycle time - word, page10ns

Product details

For a system architect clocking a 100 MHz memory controller, that leaves roughly 5 ns of setup margin after accounting for PCB trace delay and clock jitter — enough to avoid adding a second wait state. The 512K x 16 organization gives a 16-bit data path per chip, so two devices can build a 32-bit memory bank without external muxing.

For the storeroom keeper planning a five-year service spares budget, this part does not need a panic stock-up now.

Package and footprint — 44-TSOP II

Housed in a 44-TSOP II (0.400" body width, 10.16 mm wide), this is a surface-mount package with a 0.8 mm lead pitch. The footprint matches the standard JEDEC TSOP II layout, so it drops onto a board that already carries a 44-pin TSOP II SRAM. The supplier device package is explicitly 44-TSOP II — confirm the orientation notch before placement; the pin-1 indicator is on the top-left corner when the notch faces left.

Frequently asked questions

What are the equivalent or replacement parts for CY7C1051H30-10ZSXIT?

For a pin-compatible alternative within the CY7C1051 family, check other speed or temperature variants sharing the same 44-TSOP II footprint and 512K x 16 organization.