Package and footprint — 44-TSOP II
Housed in a 44-TSOP II (0.400", 10.16 mm width) package, this is a standard JEDEC surface-mount footprint that reflows well with a typical lead-free profile. The TSOP II body is narrow enough for dense board layouts but still hand-solderable under a microscope for rework.
For a new design this means no LTB risk on the horizon; for a sustaining BOM it means the line can be dual-sourced with a qualified alternate without worrying about a sudden discontinuation.
