For a system running a 50 MHz bus clock (20 ns period), this leaves 10 ns of margin for address decoding, data setup, and board trace delays — enough for a single load but tight if multiple devices share the bus.
Housed in a 36-SOJ (Small Outline J-lead) package with a 10.16 mm body width, this surface-mount part requires a standard SOJ footprint. The J-lead form factor offers good solder-joint reliability under thermal cycling, though the package is less common than SOIC — verify stencil aperture and reflow profile with your assembly house before committing the BOM. Supplied in Tape & Reel, it is ready for automated pick-and-place in volume production.