12 ns asynchronous SRAM for industrial and high-reliability systems
The CY7C1041CV33-12BAXE: The parallel interface is straightforward to hook up — no clock, no refresh cycles, just address, data, chip enable, and write enable lines.
Package and footprint — 48-TFBGA
The 48-ball TFBGA (7x8.5 mm body) is a fine-pitch BGA — the ball pitch is 0.8 mm, so a standard 4-layer PCB with via-in-pad or microvia is the expected build. The supplier device package is 48-FBGA (7x8.5).
The lifecycle status is listed as Active.