Skip to main content
Infineon Technologies CY7C1041CV33-10BAJXET — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon CY7C1041CV33-10BAJXET 4Mbit Async SRAM, 10 ns

MPNCY7C1041CV33-10BAJXET
End of Life

Infineon CY7C1041CV33-10BAJXET, asynchronous SRAM, 4Mbit (256K x 16), 10 ns access time, parallel interface, 3V to 3.6V supply, -40°C to 125°C, 48-TFBGA, Tape & Reel.

$2.8100Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CY7C1041CV33-10BAJXET specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Supply voltage3V ~ 3.6V
Memory interfaceParallel
Operating temperature-40°C ~ 125°C (TA)
PackageTape & Reel (TR)
TechnologySRAM - Asynchronous
Access time10 ns
Memory size4Mbit
Memory formatSRAM
Case48-TFBGA
Memory organization256K x 16
Write cycle time - word, page10ns

Product details

10 ns asynchronous SRAM for high-throughput cache and buffer applications

This part is a drop-in for any 3.3 V parallel SRAM socket needing fast random access — think network processor look-aside buffers, FPGA block-RAM expansion, or DSP scratchpad memory where deterministic latency matters more than sequential throughput. The 10 ns cycle time means the memory can keep pace with a 100 MHz bus without wait states, provided the controller's output hold time and setup budget are met.

48-TFBGA footprint and rework considerations

The 48-TFBGA package (7x8.5 mm body, 0.5 mm ball pitch) demands careful PCB layout and rework discipline. For the PCB layout engineer: route the 16-bit data bus and address lines with matched trace lengths to avoid skew on the 10 ns window; place decoupling capacitors within 2 mm of the BGA ball field — a 0.1 µF ceramic per supply pin pair, plus a 4.7 µF bulk cap near the package edge. Hot-air rework stations need a bottom-side preheat to 100°C to prevent cold joints on the inner balls.

For the procurement buyer, this removes the single-source risk flag that obsolete SRAMs carry — you can qualify this part into a new BOM without planning a future respin. The base product number CY7C1041 covers a family of density and speed variants; if your design later needs a different speed grade or package, the family shares the same die and interface, simplifying second-source qualification within the series.

For a system architect clocking a 100 MHz bus (10 ns period), this leaves zero margin for address decoding, PCB trace delay, and input setup at the controller — so a 10 ns SRAM is realistically a fit for buses running at 66 MHz or slower unless the controller has a programmable wait-state generator. The 256K x 16 organization gives a 16-bit word width, which halves the pin count versus a byte-wide part for the same density — useful when the FPGA or ASIC has limited I/O banks. The parallel interface is straightforward: no clock, no command sequences — just chip enable, output enable, write enable, and the address/data bus. This simplicity is the reason asynchronous SRAM still appears in latency-critical paths where SDRAM's refresh overhead is unacceptable.

Frequently asked questions

Does CY7C1041CV33-10BAJXET have an equivalent or cross-reference?

The base product number CY7C1041 covers a family of density and speed variants sharing the same die and interface. Within the CY7C1041CV33 series, speed grades and package options are pin-compatible across the 48-TFBGA footprint, allowing a direct swap for a different access time or temperature range without a PCB change.