Infineon Technologies has marked the CY7C1024DV33-10BGXIT as Obsolete. No official successor or pin-compatible replacement is recorded from the original manufacturer.
Parametric profile for BOM-fit verification
This is a 3Mbit asynchronous SRAM organized as 128K x 24. The 10 ns access time and 10 ns write cycle time (word, page) set the bus timing floor — the memory controller must meet these setup/hold windows at the parallel interface. Supply voltage range is 3V to 3.6V, operating temperature -40°C to 85°C (TA). The industrial temperature grade suits outdoor telecom, motor-drive control, and engine-bay data logging where ambient sees 85°C. Packaged in a 119-PBGA (14x22 mm) — the 1.0 mm ball pitch requires a 4-layer PCB for fan-out; two-layer boards will not route the inner rows. The Tape & Reel (TR) delivery format is standard for pick-and-place assembly.
Board integration and handling
The 119-BGA package is moisture-sensitive. Bake the parts per the MSL label before reflow if the floor-life has been exceeded — a dry bag seal is not a guarantee after storage. The 14x22 mm body with 1.0 mm pitch means the decoupling capacitors sit on the backside under the BGA; plan the via pattern accordingly. The parallel interface (Memory Interface: Parallel) connects directly to a 24-bit data bus and 17-bit address bus. No serial bridge is needed, but the trace-length matching across the full bus width matters for 10 ns timing closure.