Skip to main content
Infineon Technologies CY7C1021BV33-12ZC — Memory (DRAM / SRAM / Flash / EEPROM)

CY7C1021BV33-12ZC 1Mbit Async SRAM 12 ns 3.3V 44-TSOP II

MPNCY7C1021BV33-12ZC
Obsolete

Infineon Technologies CY7C1021BV33-12ZC, 1Mbit Asynchronous SRAM, 64K x 16, 12 ns Access Time, 3.3V Supply, 44-TSOP II Surface Mount, 0°C to 70°C Commercial Grade

$1.4000Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

CY7C1021BV33-12ZC specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Supply voltage3V ~ 3.6V
Memory interfaceParallel
Operating temperature0°C~70°C(TA)
PackageBag
TechnologySRAM - Asynchronous
Access time12 ns
Memory size1Mbit
Memory formatSRAM
Case44-TSOP (0.400\", 10.16mm Width)
Memory organization64K x 16
Write cycle time - word, page12ns

Product details

What this 1Mbit SRAM does in a 3.3V bus

The CY7C1021BV33-12ZC is a 1Mbit asynchronous SRAM organized as 64K x 16 bits, with a 12 ns access time that sets the minimum read-cycle window for the host controller. The 16-bit-wide data bus eliminates the need for byte-lane muxing on 16-bit MCUs or DSPs, saving two glue-logic packages per board. Supply range is 3.0V to 3.6V, making it a direct fit in a 3.3V memory bus without level translation. The 12 ns write cycle time matches the read access, so back-to-back read-write sequences run at the same cycle budget — no asymmetrical timing penalty. This matters for real-time control loops where the processor alternates between fetching code and logging data.

Commercial temp grade — indoor deployment only

No margin for extended industrial or automotive environments; if the board sees an engine bay, outdoor enclosure, or unheated warehouse, this package will not hold its timing specs at the cold or hot end. The 44-TSOP II package (0.400-inch body width, 10.16 mm) is a thin small-outline profile common on 1990s–2000s SRAM designs. It is surface-mount but not a fine-pitch BGA — rework with standard hot-air tools is straightforward, though the pin pitch still needs a soldermask-defined pad and careful stencil alignment.

Infineon lists this part as Obsolete. The only sourcing channel is independent distribution or excess inventory held by brokers. Because the part is obsolete, verify date code and traceability before committing to a production run. Moisture sensitivity level for TSOP II is typically MSL-3; if the parts have been stored for more than two years, a bake per J-STD-033 may be needed before reflow.

Frequently asked questions

What is the difference between CY7C1021BV33-12ZC and CY7C1021BV33-12ZI?

The suffix 'ZC' indicates a 44-TSOP II package with commercial temperature grade (0°C to 70°C). The '12' in both denotes the 12 ns access time. Package and temp grade are the only differences; pinout and memory organization are identical.

What is the access time of CY7C1021BV33-12ZC?

12 ns, both for read access and write cycle time. This sets the minimum bus cycle period when interfacing with a 3.3V host controller.

What package type does CY7C1021BV33-12ZC use?

44-TSOP II (0.400-inch body width, 10.16 mm), surface-mount. The supplier device package is also listed as 44-TSOP II.