Package and temperature grade — 48-TFBGA with wide thermal envelope
The CY7C1011G30-10BAJXET: Housed in a 48-TFBGA (6x8 mm body) with surface-mount termination, the 0.5 mm ball pitch requires a 4-layer PCB for fan-out — the inner signal layers handle the 16-bit data bus routing while the outer layers carry the 2.2-3.6V supply and ground planes.
