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Infineon Technologies CY7C0852AV-133BBC — Memory (DRAM / SRAM / Flash / EEPROM)

CY7C0852AV-133BBC Cypress 4.5Mbit Dual-Port SRAM, 133 MHz

MPNCY7C0852AV-133BBC
Obsolete

Cypress CY7C0852AV-133BBC, 4.5Mbit dual-port synchronous SRAM, 128K x 36 organization, 133 MHz clock, parallel interface, 3.135V-3.465V supply, 172-LBGA (15x15), 0°C to 70°C.

$149.3200Ref. price · indicative, final on quote
Infineon Technologies CY7C0852AV-133BBC datasheet (PDF)
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

CY7C0852AV-133BBC specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Supply voltage3.135V ~ 3.465V
Clock frequency133 MHz
Memory interfaceParallel
Operating temperature0°C~70°C(TA)
PackageTray
TechnologySRAM - Dual Port, Synchronous
Memory size4.5Mbit
Memory formatSRAM
Case172-LBGA
Memory organization128K x 36

Product details

Dual-port synchronous SRAM — 4.5 Mbit at 133 MHz

The Cypress CY7C0852AV-133BBC is a 4.5 Mbit dual-port synchronous SRAM organized as 128K x 36 bits. The 133 MHz clock frequency supports high-speed data transfers through the parallel interface, making it suitable for shared-memory applications in networking, telecom, and video processing where two independent controllers need simultaneous access to a common buffer.

Cypress no longer manufactures the CY7C0852AV-133BBC, and no official successor order code has been listed. Buyers needing this exact order code for legacy BOM maintenance or repair should source through independent distribution channels.

172-ball FBGA — rework and handling notes

The device comes in a 172-LBGA (15x15 mm FBGA) package, surface-mount only.

Frequently asked questions

Is the CY7C0852AV-133BBC obsolete?

Yes, the CY7C0852AV-133BBC is listed as Obsolete. Cypress has discontinued this part, and no official replacement order code has been published. For legacy BOM support, source through independent distribution channels.

What package is the CY7C0852AV-133BBC in?

It is supplied in a 172-LBGA package, specifically a 172-ball Fine-Pitch Ball Grid Array (FBGA) with a 15x15 mm body. The footprint is non-trivial for hand rework; a reflow oven and X-ray inspection are recommended for assembly.