Skip to main content
Infineon Technologies CY62147CV30LL-70BVI — Analog & Data Acquisition

Infineon CY62147CV30LL-70BVI MoBL SRAM, 4Mbit, 70ns

MPNCY62147CV30LL-70BVI
End of Life

Infineon Technologies MoBL® series, SRAM - Asynchronous, 4Mbit, 256K x 16, Parallel, 70 ns access, 2.7V ~ 3.3V, -40°C ~ 85°C, 48-VFBGA, Bulk.

$2.6Ref. price · indicative, final on quote
Packaging48-VFBGA
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

CY62147CV30LL-70BVI Technical Specifications
ParameterValue
SeriesMoBL®
Memory typeVolatile
Mounting typeSurface Mount
Voltage2.7V ~ 3.3V
Memory interfaceParallel
Operating temperature-40°C ~ 85°C (TA)
PackageBulk
TechnologySRAM - Asynchronous
Access time70 ns
Memory size4Mbit
Memory formatSRAM
Case48-VFBGA
Memory organization256K x 16
Write cycle time - word, page70ns

Product details

Memory density and access timing

The CY62147CV30LL-70BVI is a 4Mbit asynchronous SRAM organised as 256K words by 16 bits, with a 70 ns access time from address valid to data valid. The 70 ns cycle time sets the bus bandwidth ceiling — at a 70 ns read cycle the peak throughput is roughly 14.3 million 16-bit words per second, which is the practical limit for a parallel memory bus without wait states. The write cycle time is also 70 ns for a word write, and the page-mode write allows faster sequential writes within the same row. This part belongs to the MoBL® (More Battery Life) series, which targets low-power standby and active operation for battery-backed or portable applications.

Supply voltage and temperature grade

The 48-VFBGA package (6x8 mm body) with a 0.75 mm ball pitch requires a 4-layer PCB for fan-out of the 48 balls; the centre ground pad should be stitched to the ground plane with at least four vias to keep the thermal resistance low. The part is RoHS non-compliant (lead-bearing solder balls), so it is not suitable for RoHS-mandated production without an exemption.

Active lifecycle and sourcing

The parallel asynchronous SRAM market has few direct cross-shoppers — if a second source is required, the BOM should be qualified against another MoBL® density or a different package variant from the same family.

Frequently asked questions

What package does CY62147CV30LL-70BVI use and is it RoHS compliant?

The part is supplied in a 48-VFBGA (6x8 mm) package. It is RoHS non-compliant — the solder balls contain lead, so it requires a RoHS exemption for use in regulated markets.