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Infineon Technologies CY62128BLL-55ZAC — Microcontrollers & Processors (MCU / MPU / DSP)

CY62128BLL-55ZAC SRAM 1Mbit, 55 ns, 4.5-5.5V

MPNCY62128BLL-55ZAC
End of Life

Cypress MoBL® SRAM, 1Mbit (128K x 8), 55 ns access, 4.5-5.5V, 32-TSOP, Bulk.

$1.5Ref. price · indicative, final on quote
Packaging32-TFSOP (0.465", 11.80mm Width)
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

CY62128BLL-55ZAC Technical Specifications
ParameterValue
SeriesMoBL®
Memory typeVolatile
Mounting typeSurface Mount
Voltage4.5V ~ 5.5V
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageBulk
TechnologySRAM - Asynchronous
Access time55 ns
Memory size1Mbit
Memory formatSRAM
Case32-TFSOP (0.465\", 11.80mm Width)
Memory organization128K x 8
Write cycle time - word, page55ns

Product details

55 ns access, 1 Mbit parallel SRAM

The CY62128BLL-55ZAC is a 1 Mbit asynchronous SRAM from Cypress's MoBL® series, organized as 128K x 8 bits with a 55 ns access time.

Read and write timing

The 55 ns access time and 55 ns write cycle time set the bus timing floor — the processor must hold address and control signals stable for at least that window. The parallel interface means all eight data bits are available on the same cycle, so the memory controller's setup-and-hold budget is the same for both read and write operations.

Temperature grade and package

The 32-TSOP is a standard thin small-outline package with a 0.50 mm pitch — the footprint matches JEDEC MO-142, so a single PCB layout serves multiple SRAM suppliers.

Listed as active in production. The part is RoHS non-compliant — the lead finish is likely tin-lead, which matters for EU RoHS-exempt applications (military, aerospace, medical implant) or for legacy BOMs that require the original solder profile.