W25Q128JVPIQ

Winbond Electronics · SpiFlash® Series

IC FLASH 128MBIT SPI/QUAD 8WSON

Winbond Electronics W25Q128JVPIQ
Download datasheet (PDF)
[IN STOCK] In Stock: 7,394 pcs
$4.79/ pc

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MOQ 1 · Tube · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

W25Q128JVPIQ specifications
Parameter / AttributeSpecification / Value
SeriesSpiFlash®
Memory typeNon-Volatile
MountingSurface Mount
Supply voltage2.7V ~ 3.6V
Clock frequency133 MHz
Memory interfaceSPI - Quad I/O, QPI, DTR
Operating temperature-40°C ~ 85°C (TA)
PackageTube
TechnologyFLASH - NOR
Memory size128Mbit
Memory formatFLASH
Case8-WDFN Exposed Pad
Memory organization16M x 8
Write cycle time - word, page3ms
100% Footprint Match · Solder-Ready (No PCB Redesign Needed)

Need Stock or a Drop-in Second-Source for W25Q128JVPIQ?

Package: SOIC-8 208mil · Pin-compatible replacements with immediate Shenzhen spot stock

Footprint Match 99%
Supply Chain & Allocation Reality:

W25Q128JVSIQ is the reference SPI Flash for firmware storage on Wi-Fi/BLE IoT gateways, Linux SoC bootloaders, and FPGA configuration. GigaDevice GD25Q128CSIG and XTX XT25F128B deliver direct drop-in replacement with identical Jedec SPI instruction sets with immediate spot availability and verified lot traceability.

Verified Pin-Compatible Replacements (1 verified alternatives)

GD25Q128CSIG GigaDevice SOIC-8 208mil
100% Drop-in (Zero Code Change)
Availability & Target Pricing:

Top-Tier Flash Vendor with Full JEDEC Command Compatibility

Millions in Shenzhen Spot Stock (24h Dispatch)

Electrical & Core Specs:

Standard / Dual / Quad SPI, DTR up to 133 MHz (532 MB/s equivalent)

2.7V – 3.6V

Compatibility & Drop-In Notes: Standard SPI command set (Read: 03h/0Bh, Page Program: 02h, Sector Erase: 20h, Block Erase: D8h). If firmware validates JEDEC ID (9Fh), ensure firmware lookup table accepts GigaDevice Manufacturer ID (0xC8) alongside Winbond (0xEF).
Package & Solder Footprint: Exact 208mil SOIC-8 footprint drop-in. Compatible with high-speed SPI trace layout.
Shenzhen Warehouse Stock & MOQ: Top-tier global Flash vendor; high-volume Tier 1 OEM approved.
Buyer & Quality Checklist for Sourcing Alternatives
  • Check JEDEC ID verification in bootloader: Winbond JEDEC ID = EF 40 18h; GigaDevice JEDEC ID = C8 40 18h. If your Linux / RTOS bootloader checks exact manufacturer ID, add GD25Q128 entry to device tree / SPI flash table.
  • Verify Quad SPI (QPI) bit configuration: standard Quad Read commands (EBh) operate identically across both chips.
Frequently Asked Technical Questions

Q: Will Linux kernel mtd / spi-nor driver automatically recognize GD25Q128CSIG?

A: Yes. Mainline Linux kernel spi-nor driver has supported GD25Q128 for over a decade. It automatically reads SFDP (Serial Flash Discoverable Parameters) tables and negotiates optimal Quad SPI clock speeds.

Technical details

The Winbond W25Q128JVPIQ is a 128 Mbit (16 MB) SpiFlash® serial NOR flash organized as 16M x 8, supplied in a tube rather than on tape and reel. The tube presentation is the practical difference between this listing and its reeled siblings, and it is exactly the packaging to order for bench work, rework stations, low-volume builds, and field repair where components are placed by hand or in small batches.

Electrically it is the full-featured 128 Mbit part: 2.7 V to 3.6 V supply, -40°C to 85°C operating range, a 133 MHz clock, and a memory interface that spans standard SPI, Dual/Quad I/O, QPI, and DTR. QPI mode shortens command overhead by clocking the instruction over four lines, and DTR doubles the data window by using both clock edges, benefits that translate into faster code boot and shorter OTA windows. Page program is rated at 3 ms.

The die is packaged in an 8-lead WDFN with exposed pad, presented as an 8-WSON in the compact 6 mm x 5 mm body. That small footprint pairs well with space-limited IoT modules and portable instruments, and the exposed pad provides a direct thermal path to the ground plane during sustained programming.

If your production line is pick-and-place only, switch to the W25Q128JVPIM reel version of this same die. If you prefer a leaded body that survives multiple rework cycles, the SOIC-8 W25Q128JVSIQ is the equivalent part. For NPI runs, repair desks, and any site that assembles flash by hand, the tube-packaged JVPIQ is the practical order.

W25Q128JVPIQ
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