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Vishay General Semiconductor - Diodes Division 1.5KE13AHE3_B/C — Circuit Protection

Vishay 1.5KE13AHE3_B/C TransZorb TVS, 11.1V Standoff, 1500W

MPN1.5KE13AHE3_B/C
Active

Vishay General Semiconductor TransZorb® TVS diode, Type Zener, Automotive Grade, AEC-Q101, 1500W peak pulse, 11.1V reverse standoff, 12.4V breakdown, 18.2V clamping, DO-201AA/DO-27 Axial, Through Hole.

Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

1.5KE13AHE3_B/C specifications
ParameterValue
TypeZener
SeriesTransZorb®
MountingThrough Hole
Voltage - breakdown12.4V
Voltage - clamping (Max) @ ipp18.2V
Voltage - reverse standoff11.1V
Current - peak pulse (10/1000μs)86A
Power - peak pulse1500W (1.5kW)
Power line protectionNo
Operating temperature-55°C ~ 175°C (TJ)
GradeAutomotive
PackageTape & Reel (TR)
ApplicationsTelecom
QualificationAEC-Q101
CaseDO-201AA, DO-27, Axial
Unidirectional channels1

Product details

The 1.5KE13AHE3_B/C: The 11.1 V reverse standoff is the maximum DC voltage the TVS can hold without conducting appreciable leakage — it sits on a 12 V battery line with margin. The 12.4 V minimum breakdown means the device starts clamping before the rail reaches 13 V, protecting downstream electronics rated for 16 V abs-max. The 18.2 V maximum clamping at 86 A is the worst-case voltage the load sees during a 10/1000 µs surge event.

Automotive qualification and compliance

AEC-Q101 qualification means this TVS diode has passed the stress tests (temperature cycling, HTRB, H3TRB, ESD) required for automotive-grade semiconductor components. The part is also listed for telecom applications, reflecting its use in 12 V telecom rectifiers and base-station power supplies.

Package and mounting note

Housed in a DO-201AA (DO-27) axial-lead through-hole package. The 1.5KE series uses a glass-passivated junction in a molded case. The axial leads require a 1.0 mm diameter hole in the PCB; the body diameter is about 5.3 mm, with a lead spacing of 8.9 mm typical. The through-hole form factor is preferred for high-reliability and high-temperature environments where surface-mount solder joints may fatigue under thermal cycling.

Frequently asked questions

Where can I buy 1.5KE13AHE3_B/C and get a price?

The 1.5KE13AHE3_B/C is sourced to order against your BOM quantity.