TLP5774(TP,E

Toshiba Semiconductor

Toshiba TLP5774(TP,E, 1-channel optical-coupling gate driver, 4A peak output, 5000Vrms isolation, 35kV/µs CMTI, 15ns/8ns rise/fall, 6-SOIC package, -40°C to 110°C operation.

Toshiba Semiconductor TLP5774(TP,E
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[IN STOCK] In Stock: 2 pcs
$4.12/ pc

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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

TLP5774(TP,E specifications
Parameter / AttributeSpecification / Value
MountingSurface Mount
Voltage - isolation5000Vrms
Voltage - output supply10V ~ 30V
Voltage - forward (Vf)1.65V
Current - peak output4A
Current - output high, low3A, 3A
Current - DC forward (If)8 mA
Operating temperature-40°C ~ 110°C
Pulse width distortion50ns
Approval agencyCQC, cUR, UR, VDE
PackageTape & Reel (TR); Cut Tape (CT)
TechnologyOptical Coupling
Case6-SOIC (0.295\", 7.50mm Width)
Channels1
Rise (Fall time)15ns, 8ns
Propagation delay tpLH (tpHL)150ns, 150ns
Common mode transient immunity35kV/µs

Technical details

Why the 4A peak output matters for your power stage

The TLP5774(TP,E delivers a 4A peak output current — enough to drive medium-power IGBTs and SiC MOSFETs directly, without an external buffer stage. That saves board space and BOM cost in motor drives, UPS, and industrial power supplies. With 35kV/µs common-mode transient immunity, the part rejects fast dV/dt noise from the switching node — a common failure mode in inverter designs where the floating gate-drive signal can be corrupted by the half-bridge slew. The 5000Vrms isolation rating supports reinforced insulation per IEC 60747-5-5, qualifying it for mains-isolated gate-drive circuits in equipment rated up to 600V bus.

Switching speed and timing margin

Rise and fall times of 15ns and 8ns typical keep switching losses low at 100 kHz+ hard-switched frequencies. Maximum propagation delay is 150ns for both tpLH and tpHL, with pulse-width distortion capped at 50ns — tight enough for interleaved or phase-shifted topologies where timing skew between channels must stay under a few percent of the switching period. Compared to the TLP5752(D4-TP,E (2.5A peak), the TLP5774(TP,E adds 1.5A of peak drive current — the extra margin lets you drive larger IGBT modules or reduce gate-resistor power dissipation by switching faster.

Active production and supply posture

Sourced to order against your BOM line.

Package and mounting for the rework bench

6-SOIC package (0.295", 7.50mm width) with a 1.27mm pitch — standard SOIC-6 footprint. The 6-SO supplier device package is the same body as a standard SO-8 but with only 6 leads, so the PCB footprint matches a common SOIC-8 land pattern with the two centre pads omitted. Surface-mount mounting with a typical MSL of 1 (no moisture bake needed unless the reel has been exposed beyond the floor life). The 110°C operating maximum allows placement near the heatsink in enclosed power supplies without derating.

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