MSP430F2131TPWR
Texas Instruments
Surface MountMSP430F2xxBrown-out Detect/Reset, POR, PWM, WDT
Ref. price$1.5233
Lead time on requestGet quote
Texas Instruments MSP430 Series
2589 variants · Texas Instruments
About the Texas Instruments MSP430 Series
The Texas Instruments MSP430 Series series groups 2589 related part numbers, each listed with full specifications, a datasheet where available, and an RFQ option. Variants differ by package, case and core processor, so you can match the exact package your application requires using the selection guide below.
Select a variant by
- Package
- Bulk · Tape & Reel (TR) Cut Tape (CT) · Tape & Reel (TR); Cut Tape (CT) · Tray
- Case
- 16-VQFN Exposed Pad · 20-TSSOP (0.173\", 4.40mm Width) · 28-TSSOP (0.173\", 4.40mm Width) · 64-LQFP · 64-TQFP · 113-VFBGA
- Core processor
- - · MSP430 · MSP430 CPU16
- Number of i (O)
- 10 · 14 · 22 · 48 · 87
- Operating temperature
- -40°C ~ 85°C (TA) · -40°C~85°C(TA) · -40°C~125°C(TA)
- Program memory type
- FLASH · FLASH (256kB)
- RAM size
- 1K x 8 · 2K x 8 · 5K x 8 · 16K x 8 · 128 x 8 · 256 x 8
Variant comparison
| Parameter | MSP430A010IPMR | MSP430BT5190IZCAT | MSP430F1121ACY | MSP430F1122IPWR | MSP430F1222IPWR | MSP430F147IPM |
|---|---|---|---|---|---|---|
| Package | Tape & Reel (TR); Cut Tape (CT) | Tape & Reel (TR); Cut Tape (CT) | Bulk | Tape & Reel (TR); Cut Tape (CT) | Tape & Reel (TR); Cut Tape (CT) | Tray |
| Case | 64-LQFP | 113-VFBGA | — | 20-TSSOP (0.173\", 4.40mm Width) | 28-TSSOP (0.173\", 4.40mm Width) | 64-LQFP |
| Core processor | MSP430 | - | — | MSP430 CPU16 | MSP430 CPU16 | MSP430 CPU16 |
| Number of i (O) | 48 | 87 | — | 14 | 22 | 48 |
| Operating temperature | -40°C~85°C(TA) | -40°C~85°C(TA) | — | -40°C~85°C(TA) | -40°C~85°C(TA) | -40°C~85°C(TA) |
| Program memory type | FLASH | FLASH (256kB) | — | FLASH | FLASH | FLASH |
| RAM size | 2K x 8 | 16K x 8 | — | 256 x 8 | 256 x 8 | 1K x 8 |
Request a quote on any Texas Instruments MSP430 Series part number and we confirm price, availability and lead time per line — including end-of-life and allocation-constrained variants.
