Through-hole packaging for bench and repair
The UCC3858N: Supplied in Bulk (tube or tray), the DIP package suits hand-assembly, prototyping, and field repair — no reflow profile needed, and the pinout is easy to probe with a scope clip. The through-hole format also holds up better in high-vibration environments than a fine-pitch SMD part, as long as the leads are clinched or socketed.