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Texas Instruments UA747CN — Logic ICs

UA747CN General Purpose Op-Amp, 1 MHz, 14-DIP

MPNUA747CN
End of Life

Texas Instruments UA747CN, General Purpose Amplifier, 2 Circuits, 14-DIP (0.300", 7.62mm), Through Hole, 1 MHz Gain Bandwidth, 0.5 V/µs Slew Rate, 7 V ~ 36 V Supply.

$1.47Ref. price · indicative, final on quote
Packaging14-DIP (0.300", 7.62mm)
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

UA747CN specifications
ParameterValue
MountingThrough Hole
Amplifier typeGeneral Purpose
Voltage - input offset1 mV
Voltage - supply span36 V
Current - supply1.7mA (x2 Channels)
Current - input bias80 nA
Current - output (Channel)25 mA
Operating temperature0°C ~ 70°C
Gain bandwidth product1 MHz
PackageTube
Slew rate0.5V/µs
Case14-DIP (0.300\", 7.62mm)
Number of circuits2

Product details

Its 1 MHz gain-bandwidth product and 0.5 V/µs slew rate place it firmly in the classic 741-class performance tier — adequate for DC-level shifting, active filtering below 100 kHz, and sensor buffering where signal bandwidth is modest. The 7 V to 36 V supply span gives flexibility across 12 V and 24 V industrial rails, but the 80 nA input bias current and 1 mV input offset voltage mean precision work (microvolt-level signals, high-gain DC paths) will need external trimming or a chopper-stabilized alternative.

Through-hole DIP — still a fit for legacy boards and prototyping

The 14-DIP (0.300", 7.62mm) package with 2.54 mm pin pitch is a through-hole footprint that mates with standard breadboards, stripboards, and sockets. If your BOM still calls for a socketed DIP op-amp — for a legacy industrial controller, an audio preamp retrofit, or a lab prototype — this package is a direct drop-in. The 14-PDIP supplier device package matches the classic 741 pinout (dual in-line, offset nulls on pins 1 and 5), so it replaces older 8-pin DIP duals with the same footprint. No reflow profile needed; hand-solder or wave-solder as usual.

Active lifecycle — no EOL pressure, but watch the package trend

That said, the through-hole DIP format is a shrinking segment — most new op-amp designs migrate to surface-mount packages (SOIC, MSOP, TSSOP). For production BOMs that still require a 14-DIP dual op-amp, this part remains a valid, factory-supported choice. The ROHS3 compliance means it ships lead-free, compatible with current assembly restrictions.

Frequently asked questions

What is a replacement for UA747CN?

A direct pin-compatible replacement is the LM747CN, which shares the same 14-DIP footprint and general-purpose dual-op-amp function. For a surface-mount alternative with higher bandwidth and rail-to-rail output, consider the TLV9362IDDFR (10.6 MHz, 25 V/µs, SOIC-8), though the pinout differs — a board spin is required.