TXB0104YZTR

Texas Instruments

Texas Instruments TXB0104YZTR, 4-channel bidirectional voltage-level translator, 100 Mbps data rate, auto-direction sensing, 1.2 V to 5.5 V supply range, 12-DSBGA package, -40°C to 85°C.

Texas Instruments TXB0104YZTR
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[IN STOCK] In Stock: 36 pcs
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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

TXB0104YZTR specifications
Parameter / AttributeSpecification / Value
Output typeTri-State, Non-Inverted
Channel typeBidirectional
MountingSurface Mount
Translator typeVoltage Level
Voltage - VCCA1.2 V ~ 3.6 V
Voltage - VCCB1.65 V ~ 5.5 V
Operating temperature-40°C~85°C(TA)
PackageTape & Reel (TR); Cut Tape (CT)
FeaturesAuto-Direction Sensing
Data rate100Mbps
Case12-UFBGA, DSBGA
Number of circuits1
Channels per circuit4

Technical details

What this level shifter does on your board

The output type is tri-state, non-inverted, and the single-circuit device supports four channels per package.

The 100 Mbps data rate covers most SPI, UART, I2C (fast-mode plus), and general-purpose GPIO level-shifting needs. If your design runs a high-speed parallel bus or a multi-megabit serial link above 100 Mbps, this part will not keep up — consider a faster translator like the TXU0304BQAR (200 Mbps) or SN74LXC2T45DTTR (420 Mbps) for those cases. The auto-direction sensing eliminates the direction pin that older level shifters (e.g., 74LVC4245) require, which saves a GPIO on the microcontroller and simplifies firmware — no toggling of a DIR line on every bus turn-around. However, the auto-sense circuit adds a propagation delay and output-enable settling time; for push-pull signals below 100 Mbps it works transparently, but open-drain buses (I2C) may need an external pull-up and careful timing analysis.

Supply rails and voltage compatibility

This covers the common low-voltage cores (1.2 V, 1.8 V, 2.5 V, 3.3 V) on the A side and the higher-voltage peripherals (3.3 V, 5 V) on the B side. The 1.2 V minimum on VCCA means it can interface directly with the newest 1.2 V FPGAs and MCUs. Note that VCCA must always be less than or equal to VCCB — the part does not support stepping down from a higher A-side voltage to a lower B-side voltage. The supply sequencing is not critical as long as both rails are within the specified range, but TI recommends powering VCCA first or simultaneously to avoid undefined output states during ramp-up.

The 12-DSBGA package measures 1.9x1.4 mm with a 0.5 mm ball pitch. This is a wafer-level chip-scale package (DSBGA) — no leads, just solder balls on the bottom. The supplier device package code is 12-DSBGA (1.9x1.4).

It is ROHS3 compliant.

TXB0104YZTR
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