PMIC for OMAP handheld designs — what it does
The TPS65921B1ZQZ is a power-management IC from Texas Instruments, purpose-built as a companion for TI OMAP processors in handheld and mobile devices. It integrates multiple voltage rails, sequencing, and housekeeping functions into a single 120-VFBGA Microstar Junior package measuring 6x6 mm. Quiescent current is 300 µA — low enough to keep the always-on domain alive without draining the pack during sleep.
Availability is limited to surplus and broker inventory.
The 120-VFBGA (Very Fine-pitch Ball Grid Array) uses a 0.50 mm ball pitch. The 6x6 mm body with 120 balls demands a controlled-impedance PCB stack-up and X-ray inspection after reflow. Surface-mount only — no through-hole variant. The BGA footprint requires solder paste stencil design matched to the ball diameter; a 0.35 mm aperture with 0.125 mm stencil thickness is a typical starting point for this pitch class.