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Texas Instruments TPS659122YFFR — Power Management (PMIC / Gate Driver)

TI TPS659122YFFR Processor PMIC, 32µA, 1.8V-5.5V, 81-DSBGA

MPNTPS659122YFFR
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Texas Instruments TPS659122YFFR processor power management IC, 32µA supply current, 1.8V to 5.5V input range, -40°C to 85°C operating temperature, 81-DSBGA 3.6x3.6mm package, Tape & Reel.

$4.3560Ref. price · indicative, final on quote
Texas Instruments TPS659122YFFR datasheet (PDF)
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

TPS659122YFFR specifications
ParameterValue
MountingSurface Mount
Supply voltage1.8V ~ 5.5V
Current - supply32µA
Operating temperature-40°C~85°C
PackageTape & Reel (TR)
ApplicationsProcessor
Case81-UFBGA, DSBGA

Product details

Processor PMIC with 32µA standby overhead

The 1.8V to 5.5V supply range lets this part sit on a single-cell Li-ion (3.0V-4.2V nominal) or a regulated 5V rail without a pre-regulator — the BOM saves the LDO or buck that a fixed-input PMIC would need.

81-DSBGA 3.6x3.6mm — footprint and fan-out

The 81-DSBGA (3.6x3.6mm) package is a 0.4mm-pitch BGA — the 3.6mm body keeps the board footprint small, but the fine pitch demands a 4-layer PCB minimum for fan-out; two-layer boards will struggle to route all balls without via-in-pad.

Frequently asked questions

What is TPS659122YFFR used for?

The TPS659122YFFR is a power management IC designed for processor applications — it manages the voltage rails and sequencing for a processor core, I/O, and memory, typically in embedded systems, industrial controllers, and portable devices.

What package does TPS659122YFFR come in?

The TPS659122YFFR is supplied in an 81-DSBGA (3.6x3.6mm) package, shipped in Tape & Reel. The 0.4mm ball pitch requires a 4-layer PCB for reliable fan-out.