Handheld PMIC in a 169-ball BGA
The TPS658643ZWSR is a Texas Instruments advanced power management IC (PMIC) built for handheld and mobile devices — the 169-LFBGA package (12x12 mm body, 0.8 mm pitch) keeps the footprint compact while routing multiple power rails through the BGA array.
The 169-NFBGA supplier device package (12x12 mm) is a fine-pitch BGA — the 0.8 mm ball pitch demands a 4-layer PCB for reliable fan-out and a controlled reflow profile with a peak temperature within the JEDEC MSL rating for the package.
The base product number is TPS658643; the ZWSR suffix denotes the 169-NFBGA package and tape-and-reel or cut-tape delivery format.